Vacuum Reflow Soldering Furnace Heller 1936 MK VR

The vacuum reflow soldering furnace 1936 MK VR provides a high level of repeatability with a lower Δ T. 8 convection zones (12 inches long) and 1 independent infrared heating zone provide consistent performance for high-capacity requirements while reducing.....

The vacuum reflow soldering furnace 1936 MK VR provides a high level of repeatability with a lower Δ T. 8 convection zones (12 inches long) and 1 independent infrared heating zone provide consistent performance for high-capacity requirements while reducing maintenance requirements and ownership costs.

Reflux furnace length: 589 cm
Process gas options: air, nitrogen, formic acid, synthetic gas
Heating zone: convection: 8 top/8 bottom IR: 3 top
Cooling zone: 3 top (bottom option)
Maximum operating temperature (convection/infrared): Standard: 350 ° C/400 ° C, optional: 400 ° C/480 ° C
Minimum vacuum degree: Standard: 10 Torr Options:& lt 10 Torr
Maximum circuit board size: 350mm (length) x 350mm (width) x 29mm (height)
Cleanroom options: as low as 1000 levels

The main advantages of the Heller vacuum reflow soldering furnace are:

Low altitude hole rate
By utilizing vacuum circulation during the reflow process, these vacuum reflow soldering furnaces can remove voids in solder joints and interfaces.
Higher UPH
Our vacuum reflow soldering furnace offers optional segmented tracks for faster vacuum chamber transfer time. Dual track can also be used to improve throughput.
No shifting components
The smooth running track system ensures that components will not shift or move during the entire reflow soldering process. The vibration experienced by the plates on the track during transportation is relatively small, including entering and leaving the vacuum chamber.
Nitrogen inert atmosphere reaches 10 ppm, reducing N2 consumption by 50%!
Our vacuum pump provides closed-loop control for controlled multi-step evacuation and refilling. This can prevent quality killer solder joints and flux splatters that may occur with single-stage open-loop vacuum systems provided by competitors.

Infrared heating vacuum chamber

Infrared heaters allow for peak temperature to be reached within the vacuum chamber, thereby shortening the time above the liquidus line and improving process flexibility. The high chamber temperature ensures that no solder flux accumulates inside the chamber.

Award winning flux separation system

Filter free flux separation system
Water cooling option can improve cooling speed
Easy cleaning mode, only takes 30 minutes
Nitrogen inert atmosphere
The oxygen content is as low as 10 PPM, reducing N2 consumption by 50%. By implementing closed-loop control for oxygen monitoring, strict process control can be achieved!

We focus on providing the following SMT equipment production solutions for electronic manufacturers:
Printing machines SPI、 SMT machine AOI、 Reflow soldering, X-Ray and other SMT production line equipment;
SMT peripheral equipment such as loading and unloading machines, connecting tables, coating machines, dispensing machines, and material receiving machines;
Feida, suction nozzle, board, air valve, belt, spare parts, consumables and other services and solutions.