A Guide to the Applications of Copper Clad Laminate

31 Jul.,2025

What forms the foundation of our modern electronic world?

 

What forms the foundation of our modern electronic world? Copper clad laminate (CCL)! Every electronic component we encounter in daily life relies on this essential material, earning it the title of the “mother of electronic products.” While the term might sound unfamiliar to some, most people have actually seen it—take the motherboard in your computer, for instance, which depends on copper clad laminate for support. This article delves into the features and applications of CCL to enhance your understanding of this crucial material.

What is Copper Clad Laminate?

Copper clad laminate is a type of board where a layer of copper foil is bonded to a non-conductive substrate. It typically consists of two main parts: the copper layer and the base material. The copper layer is a highly conductive copper foil, while the base material is non-conductive, such as fiberglass or polyimide. In PCB manufacturing, CCL plays a critical role in connecting circuits and is an indispensable component of electronic devices.

Structure of Copper Clad Laminate

Copper clad laminate (CCL) is primarily composed of three elements: reinforcing materials, resin, and copper foil. Here’s a detailed look at its structure:

Reinforcing Materials:

The reinforcing material provides mechanical strength and dimensional stability, supporting and reinforcing the CCL.

  • Common Materials:
    • Wood pulp paper: Used mainly for producing flame-retardant CCL. It is more affordable but offers lower mechanical strength compared to fiberglass.
    • Fiberglass fabric: Preferred for high-performance CCL due to its superior mechanical strength and heat resistance.

Resin:

Resin binds the reinforcing material to the copper foil, curing them into a cohesive whole.

  • Types of Resin:
    • Phenolic resin
    • Epoxy resin
    • Polyimide resin
      Each resin type has distinct properties such as heat resistance, moisture resistance, and flame retardancy, making them suitable for different applications.

Copper Foil:

The copper foil serves as the conductive layer on the surface of the laminate, enabling electrical connections within circuits.

  • Key Factors:
    • Thickness: Thinner copper foil reduces weight and improves conductivity but is more challenging to process.
    • Roughness: Influences adhesion strength with resin and the precision of circuit fabrication.
Structure of copper clad laminate
Structure of copper clad laminate

Classification of Copper Clad Laminate

Copper clad laminate can be categorized based on various criteria, including mechanical rigidity, resin type, insulation material, and flame resistance:

Category Description
By Rigidity Rigid CCL, Flexible CCL
By Resin Type Phenolic Resin CCL, Epoxy Resin CCL, and Polyimide Resin CCL
By Insulating Material Organic Resin-based CCL, Metal-based CCL, Ceramic-based CCL
By Thickness 0.8mm to 3.2mm, less than 0.78mm (without copper)
By Fire Resistance UL94 standards, UL-94V0 (highest level)
By Thermal and Dielectric Properties High Tg CCL, Low Dk/Low Df CCL

 

 

 

 

 

 

 

 

 

Features of Copper Clad Laminate

Copper clad laminate (CCL) boasts the following key features:

  • Exceptional Conductivity: The surface layer of CCL consists of pure copper foil, offering excellent electrical conductivity to ensure effective current transmission and reliable circuit operation.
  • Superior Thermal Conductivity: With copper’s high thermal conductivity, the copper foil layer efficiently dissipates heat, maintaining the electronic device’s temperature within a safe operating range.
  • High Strength and Durability: Laminated during production, CCL exhibits impressive strength and wear resistance, enabling it to withstand mechanical stress and environmental corrosion.
  • Ease of Processing: The use of copper foil makes CCL highly adaptable for cutting, shaping, hole drilling, and other processes, meeting the demands of complex circuit board designs and manufacturing.

A Guide to the Applications of Copper Clad Laminate 

Applications of Copper Clad Laminate

As the foundational material for printed circuit boards (PCBs), CCL plays a vital role in electrical conduction, insulation, and mechanical support. It directly impacts the transmission speed, energy efficiency, and impedance characteristics of PCB products. CCL is widely used across various fields:

  • Electronic Devices: Essential for smartphones, computers, and televisions, CCL serves as the PCB substrate, providing electrical connections, mechanical support, and heat dissipation.
  • Communication Equipment: Meeting the demands of high-frequency signal transmission, CCL is extensively used in communication base stations and optoelectronic devices.
  • Power Industry: Found in power supplies, transformers, and other equipment, CCL enhances operational efficiency and effectiveness.
  • Instrumentation: Used in measuring instruments and control systems, CCL ensures accuracy and reliability.
  • Automotive Industry: Found in key components like electronic control modules and sensors, CCL improves vehicle safety and performance.
  • Military Industry: Integral to military systems such as radar and navigation, CCL supports high-speed signal transmission and anti-interference capabilities.

Additionally, CCL is employed in aerospace, medical electronics, and renewable energy sectors.

Relationship and Differences Between CCL and PCB

Differences:

  1. Functionality:
    • CCL: Primarily facilitates conductivity, enabling the connection and electrical transmission of electronic components.
    • PCB: Besides conductivity, it also provides layout for components, organizes circuit structures, and offers mechanical support and protection.
  2. Manufacturing Process:
    • CCL: Simpler, involving copper foil bonding and cutting.
    • PCB: More complex, encompassing processes like imaging, exposure, etching, drilling, plating, and pad application.
  3. Applications:
    • CCL: Used for electrical connections, conductive gaskets, and grounding shields, commonly seen in prototypes, modular circuits, and consumer electronics.
    • PCB: Extensively applied in electronic devices, communication systems, automotive electronics, and household appliances, forming a critical component of electronic products.

Relationship:

CCL is a crucial upstream material for PCB manufacturing, often referred to as its substrate. It fulfills four primary roles: conductivity, insulation, support, and signal transmission.

Future Trends

With technological advancements, the application scope of CCL continues to expand, accompanied by increasing performance demands. For instance, in 5G communications and high-speed circuit boards, there is a growing need for ultra-thin fiberglass and other high-performance materials.

As a pivotal electronic material, CCL plays an indispensable role in electronics, communication systems, and the power industry. Its application prospects will only grow broader with continuous technological progress.